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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
ACC-HS4-SET

ACC-HS4-SET

ACC HEATSINK ME ACC-HS4

Enclustra FPGA Solutions

3,864 42.32

RFQ

Box ACC-HS4 Active - Bolt On Rectangular 2.913 (74.00mm) 2.126 (54.00mm) - 0.571 (14.50mm) - - - -
HS-ZX-SET-R2

HS-ZX-SET-R2

ACC HEATSINK MA-ZX*/AX3

Enclustra FPGA Solutions

3,086 17.00

RFQ

Box - Active - - - - - - - - - - -
HS-XU3-SET-R2

HS-XU3-SET-R2

ACC HEATSINK MA-XU3

Enclustra FPGA Solutions

2,318 24.72

RFQ

Box Mars XU3 Active - - - - - - - - - - -
ACC-HS3-SET

ACC-HS3-SET

ACC HEATSINK ME ACC-HS3

Enclustra FPGA Solutions

2,245 42.32

RFQ

Box ACC-HS3 Active - Bolt On Rectangular 2.205 (56.00mm) 1.063 (27.00mm) - 0.571 (14.50mm) - - - -
HS-MA3-R1-SET-R1

HS-MA3-R1-SET-R1

HEATSINK MARS MA3

Enclustra FPGA Solutions

2,317 15.90

RFQ

Bag Mars MA3 Active Top Mount - - - - - - - - - -
HS-ZX-R1-SET-R1

HS-ZX-R1-SET-R1

HEATSINK MARS ZX2 ZX3

Enclustra FPGA Solutions

2,873 15.90

RFQ

Bag Mars ZX2, ZX3 Active Top Mount - - - - - - - - - -
HS-XU3-R1-SET-R1

HS-XU3-R1-SET-R1

HEATSINK MARS XU3

Enclustra FPGA Solutions

3,415 23.12

RFQ

Bag Mars XU3 Active Top Mount - - - - - - - - - -
EN104037

EN104037

ACC HEATSINK MA-MA3

Enclustra FPGA Solutions

2,395 0.00

RFQ

Box Mars MA3 Obsolete - - - - - - - - - - -
Daily average RFQ Vo
1500+ Daily average RFQ Vo
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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