Chip Start Electronics Co., Limited

More product categories >>

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
514-83-478M26-131148 CONN SOCKET BGA 478POS GOLD Preci-Dip	3,036	52.41	RFQ	Datasheet	Bulk	514	Active	BGA	478 (26 x 26)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-600M35-001148 CONN SOCKET BGA 600POS GOLD Preci-Dip	3,064	52.58	RFQ	Datasheet	Bulk	514	Active	BGA	600 (35 x 35)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-480M29-001148 CONN SOCKET BGA 480POS GOLD Preci-Dip	2,690	52.63	RFQ	Datasheet	Bulk	514	Active	BGA	480 (29 x 29)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-478M26-131152 BGA SOLDER TAIL Preci-Dip	2,256	52.86	RFQ	Datasheet	Bulk	550	Active	BGA	478 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
550-10-480M29-001152 BGA SOLDER TAIL Preci-Dip	3,285	53.08	RFQ	Datasheet	Bulk	550	Active	BGA	480 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-456M26-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2,546	53.34	RFQ	Datasheet	Bulk	558	Active	PGA	456 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-420M26-001106 CONN SOCKET PGA 420POS GOLD Preci-Dip	2,203	53.36	RFQ	Datasheet	Bulk	518	Active	PGA	420 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-432M31-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2,280	53.66	RFQ	Datasheet	Bulk	558	Active	BGA	432 (31 x 31)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-432M31-001105 CONN SOCKET PGA 432POS GOLD Preci-Dip	3,008	53.88	RFQ	Datasheet	Bulk	518	Active	PGA	432 (31 x 31)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
546-83-528-21-121147 CONN SOCKET PGA 528POS GOLD Preci-Dip	2,747	54.45	RFQ	Datasheet	Bulk	546	Active	PGA	528 (21 x 21)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-529-21-121147 CONN SOCKET PGA 529POS GOLD Preci-Dip	2,709	54.55	RFQ	Datasheet	Bulk	546	Active	PGA	529 (21 x 21)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-545-17-000147 CONN SOCKET PGA 545POS GOLD Preci-Dip	3,303	54.56	RFQ	Datasheet	Bulk	546	Active	PGA	545 (17 x 17)	0.050 (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-500M30-001148 CONN SOCKET BGA 500POS GOLD Preci-Dip	2,107	54.83	RFQ	Datasheet	Bulk	514	Active	BGA	500 (30 x 30)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-432M31-001106 CONN SOCKET PGA 432POS GOLD Preci-Dip	2,922	54.88	RFQ	Datasheet	Bulk	518	Active	PGA	432 (31 x 31)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
514-83-504M29-001148 CONN SOCKET BGA 504POS GOLD Preci-Dip	2,726	55.27	RFQ	Datasheet	Bulk	514	Active	BGA	504 (29 x 29)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-500M30-001152 BGA SOLDER TAIL Preci-Dip	2,465	55.29	RFQ	Datasheet	Bulk	550	Active	BGA	500 (30 x 30)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
550-10-504M29-001152 BGA SOLDER TAIL Preci-Dip	2,147	55.73	RFQ	Datasheet	Bulk	550	Active	BGA	504 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-478M26-131101 PGA SOLDER TAIL 1.27MM Preci-Dip	3,339	55.91	RFQ	Datasheet	Bulk	558	Active	PGA	478 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-480M29-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3,245	56.15	RFQ	Datasheet	Bulk	558	Active	PGA	480 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-456M26-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	3,258	56.64	RFQ	Datasheet	Bulk	558	Active	BGA	456 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass