All Categories
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-089-12-051101

510-83-089-12-051101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

3,150 4.26

RFQ

510-83-089-12-051101

Datasheet

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-089-13-082101

510-83-089-13-082101

CONN SOCKET PGA 89POS GOLD

Preci-Dip

2,197 4.26

RFQ

510-83-089-13-082101

Datasheet

Bulk 510 Active PGA 89 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-12-051101

510-83-084-12-051101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3,537 4.27

RFQ

510-83-084-12-051101

Datasheet

Bulk 510 Active PGA 84 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-081101

510-83-084-13-081101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3,095 4.27

RFQ

510-83-084-13-081101

Datasheet

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-13-082101

510-83-084-13-082101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2,864 4.27

RFQ

510-83-084-13-082101

Datasheet

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-006101

116-83-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,036 4.54

RFQ

116-83-652-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-005101

110-83-964-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2,586 4.28

RFQ

110-83-964-41-005101

Datasheet

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-324-10-001101

299-87-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,822 4.28

RFQ

299-87-324-10-001101

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-064-01-505101

110-83-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3,351 4.28

RFQ

110-83-064-01-505101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-648-31-012101

614-83-648-31-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,342 4.28

RFQ

614-83-648-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-952-41-001101

614-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,952 4.30

RFQ

614-83-952-41-001101

Datasheet

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-009101

116-87-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,571 4.30

RFQ

116-87-642-41-009101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-096-11-041101

510-83-096-11-041101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

3,002 4.60

RFQ

510-83-096-11-041101

Datasheet

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-018101

116-83-650-41-018101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,295 4.58

RFQ

116-83-650-41-018101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-143-15-081101

510-87-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip

3,468 4.31

RFQ

510-87-143-15-081101

Datasheet

Bulk 510 Active PGA 143 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-006101

116-83-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,549 4.32

RFQ

116-83-648-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-003101

116-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,473 4.60

RFQ

116-83-648-41-003101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-144-15-081101

510-87-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

3,883 4.34

RFQ

510-87-144-15-081101

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-035101

146-87-648-41-035101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,822 4.34

RFQ

146-87-648-41-035101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-648-41-036101

146-87-648-41-036101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,461 4.34

RFQ

146-87-648-41-036101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Records«Prev1... 8586878889909192...142Next»
Daily average RFQ Vo
1500+ Daily average RFQ Vo
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER