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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
BU280Z-178-HTCONN IC DIP SOCKET 28POS GOLD |
3,952 | 2.89 |
RFQ |
Datasheet |
Tube | BU-178HT | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU060Z-178-HTCONN IC DIP SOCKET 6POS GOLD |
2,900 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU160Z-178-HTCONN IC DIP SOCKET 16POS GOLD |
2,769 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU180Z-178-HTCONN IC DIP SOCKET 18POS GOLD |
3,143 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU200Z-178-HTCONN IC DIP SOCKET 20POS GOLD |
3,410 | 0.00 |
RFQ |
Datasheet |
Bulk | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU240Z-178-HTCONN IC DIP SOCKET 24POS GOLD |
3,619 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU400Z-178-HTCONN IC DIP SOCKET 40POS GOLD |
3,865 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU480Z-178-HTCONN IC DIP SOCKET 48POS GOLD |
2,467 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU640Z-178-HTCONN IC DIP SOCKET 64POS GOLD |
2,743 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
WMS-060ZCONN IC DIP SOCKET 6POS GOLD |
2,793 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-080ZCONN IC DIP SOCKET 8POS GOLD |
2,605 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-140ZCONN IC DIP SOCKET 14POS GOLD |
2,645 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-160ZCONN IC DIP SOCKET 16POS GOLD |
3,409 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-180ZCONN IC DIP SOCKET 18POS GOLD |
3,112 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-200ZCONN IC DIP SOCKET 20POS GOLD |
3,332 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-2410ZCONN IC DIP SOCKET 24POS GOLD |
3,326 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-280ZCONN IC DIP SOCKET 28POS GOLD |
2,632 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
WMS-320ZCONN IC DIP SOCKET 32POS GOLD |
3,181 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
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|
WMS-400ZCONN IC DIP SOCKET 40POS GOLD |
2,008 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
|
|
WMS-100ZCONN IC DIP SOCKET 10POS GOLD |
3,920 | 0.00 |
RFQ |
Datasheet |
Tube | WMS | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - |
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