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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-3518-10T

06-3518-10T

SOCKET W/SOLDER TAIL PINS TIM

Aries Electronics

2,517 0.84

RFQ

- 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-11

03-0513-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,698 0.84

RFQ

03-0513-11

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-10

05-0513-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,941 0.84

RFQ

05-0513-10

Datasheet

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0518-10T

06-0518-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,609 0.84

RFQ

06-0518-10T

Datasheet

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10T

06-1518-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,225 0.84

RFQ

06-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-10

07-0518-10

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3,294 0.84

RFQ

07-0518-10

Datasheet

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10H

06-1518-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,950 0.87

RFQ

06-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0517-90C

02-0517-90C

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3,579 0.87

RFQ

02-0517-90C

Datasheet

Bulk 0517 Active SIP 2 (1 x 2) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-10

06-3518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,668 0.89

RFQ

06-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-11

05-0518-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,151 0.89

RFQ

05-0518-11

Datasheet

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-10T

07-0518-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,427 0.96

RFQ

07-0518-10T

Datasheet

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-10

08-1518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,943 0.96

RFQ

08-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0513-11H

03-0513-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2,040 0.98

RFQ

03-0513-11H

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-10H

04-0513-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,881 0.98

RFQ

04-0513-10H

Datasheet

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-00

06-3518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,285 0.98

RFQ

06-3518-00

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3513-10T

06-3513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,045 1.06

RFQ

06-3513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-10

06-0513-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,361 1.08

RFQ

06-0513-10

Datasheet

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0508-20

02-0508-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,147 1.08

RFQ

02-0508-20

Datasheet

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-0508-30

02-0508-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,651 1.08

RFQ

02-0508-30

Datasheet

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-1508-20

02-1508-20

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,814 1.08

RFQ

02-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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Daily average RFQ Vo
1500+ Daily average RFQ Vo
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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