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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-6501-31

24-6501-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,777 13.49

RFQ

24-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6823-90

18-6823-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,860 13.47

RFQ

18-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-6820-90

18-6820-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,002 13.47

RFQ

18-6820-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
24-0503-20

24-0503-20

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,467 13.51

RFQ

24-0503-20

Datasheet

Bulk 0503 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
24-0503-30

24-0503-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,842 13.51

RFQ

24-0503-30

Datasheet

Bulk 0503 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-3508-202

20-3508-202

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,807 13.51

RFQ

20-3508-202

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-302

20-3508-302

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,511 13.51

RFQ

20-3508-302

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6820-90C

24-6820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,441 13.58

RFQ

24-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6822-90C

24-6822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,812 13.58

RFQ

24-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6823-90C

24-6823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,739 13.58

RFQ

24-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-7350-10

15-7350-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,433 13.55

RFQ

15-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7450-10

15-7450-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,666 13.55

RFQ

15-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7500-10

15-7500-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,030 13.55

RFQ

15-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7540-10

15-7540-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,153 13.55

RFQ

15-7540-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7635-10

15-7635-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,676 13.55

RFQ

15-7635-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7695-10

15-7695-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,919 13.55

RFQ

15-7695-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7850-10

15-7850-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,569 13.55

RFQ

15-7850-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-21

14-0501-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,533 13.62

RFQ

14-0501-21

Datasheet

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-31

14-0501-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,492 13.62

RFQ

14-0501-31

Datasheet

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-01

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,861 13.62

RFQ

24-4518-01

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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Standard Product Unit
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In-stock Warehouse
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