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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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10-8723-210CCONN IC DIP SOCKET 10POS GOLD |
2,830 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8745-210CCONN IC DIP SOCKET 10POS GOLD |
2,177 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8796-210CCONN IC DIP SOCKET 10POS GOLD |
2,396 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8800-210CCONN IC DIP SOCKET 10POS GOLD |
3,449 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8810-210CCONN IC DIP SOCKET 10POS GOLD |
2,056 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8828-210CCONN IC DIP SOCKET 10POS GOLD |
3,932 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8850-210CCONN IC DIP SOCKET 10POS GOLD |
3,493 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-8875-210CCONN IC DIP SOCKET 10POS GOLD |
3,669 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109565SERIES 8XXX ELEV SCKT .300/.600 |
3,868 | 0.00 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
14-8500-311CCONN IC DIP SOCKET 14POS GOLD |
2,330 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-8500-611CCONN IC DIP SOCKET 14POS GOLD |
2,046 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-8325-311CCONN IC DIP SOCKET 16POS GOLD |
3,240 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-811250-610CCONN IC DIP SOCKET 18POS GOLD |
2,061 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
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20-8750-310CCONN IC DIP SOCKET 20POS GOLD |
2,586 | 0.00 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
24-8190-610CCONN IC DIP SOCKET 24POS GOLD |
2,746 | 0.00 |
RFQ |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1108883-05SERIES 0517 PIN-LINE VERTISOCKET |
3,971 | 0.00 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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181-PGM18041-10CONN SOCKET PGA GOLD |
3,620 | 0.00 |
RFQ |
Datasheet |
Bulk | PGM | Obsolete | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
192-PG17043-10HCONN SOCKET PGA GOLD |
2,184 | 0.00 |
RFQ |
Datasheet |
Bulk | PG | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
233-PGM18039-51CONN SOCKET PGA GOLD |
2,061 | 0.00 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
256-PG16001-10HCONN SOCKET PGA GOLD |
3,753 | 0.00 |
RFQ |
Datasheet |
Bulk | PG | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
- 1500+ Daily average RFQ Vo
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