Chip Start Electronics Co., Limited

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Sockets for ICs, Transistors(21991)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
614-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,401	0.30	RFQ	Datasheet	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-003101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,156	0.30	RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-304-41-035101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,578	0.31	RFQ	Datasheet	Bulk	146	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-304-41-036101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,421	0.31	RFQ	Datasheet	Bulk	146	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-005101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,370	0.33	RFQ	Datasheet	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-605101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,586	0.33	RFQ	Datasheet	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,822	0.31	RFQ	Datasheet	Bulk	612	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-002101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,353	0.31	RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-21/Z-T SOCKET 21 CONTACTS SINGLE ROW Assmann WSW Components	2,298	0.34	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
02-0518-10 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,429	0.34	RFQ	Datasheet	Bulk	518	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,252	0.34	RFQ	Datasheet	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
115-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	2,975	0.34	RFQ		Bulk	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-012-05-001101 CONN SOCKET PGA 12POS GOLD Preci-Dip	3,120	0.32	RFQ	Datasheet	Bulk	510	Active	PGA	12 (5 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-41-005101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	2,672	0.32	RFQ	Datasheet	Bulk	110	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-008101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,999	0.32	RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105161 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,980	0.42	RFQ	Datasheet	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-006101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,905	0.32	RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED028PLCZ-SM-N CONN SOCKET PLCC 28POS On Shore Technology Inc.	3,585	0.35	RFQ	Datasheet	Tube	ED	Active	PLCC	28 (2 x 14)	0.050 (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)
AW 127-22/Z-T SOCKET 22 CONTACTS SINGLE ROW Assmann WSW Components	2,209	0.35	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1571994-2 CONN SOCKET SIP 2POS GOLD TE Connectivity AMP Connectors	2,291	0.35	RFQ	Datasheet	Bulk	510	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	20.0µin (0.51µm)	Copper	Thermoplastic, Polyester