info@chipstartic.com
Upload BOM
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2201838-1CONN SOCKET LGA 2011POS GOLD |
269 | 25.21 |
RFQ |
Datasheet |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
1-2324271-2LEFT SEGMEN LGA4189-4 SOCKET-P4 |
2,972 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-1RIGHT SEGMEN LGA4189-4 SOCKET-P4 |
114 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
3-1571550-0CONN IC DIP SOCKET 32POS GOLD |
704 | 10.96 |
RFQ |
Datasheet |
Tube | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2319757-1DUAL LGA,257 POS, DMD SOCKET |
913 | 18.66 |
RFQ |
Datasheet |
Tray | DMD | Active | LGA | 257 (20 x 30) | 0.039 (1.00mm) | Gold | 3.00µin (0.076µm) | Copper Alloy | Surface Mount | Board Guide, Open Frame | Solder | - | - | - | - | Thermoplastic |
|
8080-1G1-LFCONN TRANSIST TO-3 3POS TIN |
379 | 28.04 |
RFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
1-2324271-6LEFT SEGMEN LGA4189-5 SOCKET-P5 |
165 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1-2324271-5RIGHT SEGMEN LGA4189-5 SOCKET-P5 |
163 | 29.22 |
RFQ |
Datasheet |
Tray | - | Active | LGA 4189 | 2092 | 0.039 (1.00mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.034 (0.86mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
2-2129710-7CONN SOCKET LGA 3647POS GOLD |
154 | 34.55 |
RFQ |
Datasheet |
Tray | - | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic |
|
4-1571552-2CONN IC DIP SOCKET 14POS GOLD |
1,704 | 1.61 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
808-AG11D-LFCONN IC DIP SOCKET 8POS GOLD |
2,657 | 1.77 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-1571551-2CONN IC DIP SOCKET 8POS GOLD |
4,214 | 2.07 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
520-AG11D-ESDIP SOCKET T/H 20POS |
867 | 3.55 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD |
1,786 | 3.95 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1-1571552-2CONN IC DIP SOCKET 40POS TIN |
142 | 4.34 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
816-AG11DCONN IC DIP SOCKET 16POS GOLD |
960 | 4.70 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
516-AG12D-LFCONN IC DIP SOCKET 16POS TIN |
1,173 | 5.04 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
822-AG11DCONN IC DIP SOCKET 22POS GOLD |
1,669 | 5.08 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
818-AG11DCONN IC DIP SOCKET 18POS GOLD |
432 | 5.25 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
1-1571994-0CONN SOCKET SIP 10POS GOLD |
118 | 5.52 |
RFQ |
Datasheet |
Tube | 510 | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
- 1500+ Daily average RFQ Vo
- 20,000.000 Standard Product Unit
- 1800+ Worldwide Manufacturers
- 15,000+ In-stock Warehouse
