Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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3-1571586-3CONN IC DIP SOCKET 42POS GOLD |
2,086 | 16.97 |
RFQ |
![]() Datasheet |
Tube,Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper Alloy | Polyester |
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6-1437532-1CONN IC DIP SOCKET 32POS GOLD |
3,877 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polyester |
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8-1437531-6CONN IC DIP SOCKET 20POS TINLEAD |
3,130 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | - |
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532-AG11D-ESCONN IC DIP SOCKET 32POS GOLD |
2,017 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
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828-AG12DCONN IC DIP SOCKET 28POS TINLEAD |
2,694 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
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8080-1G16CONN SOCKET TRANSIST TO-3 3POS |
3,350 | 0.00 |
RFQ |
![]() Datasheet |
Bulk | 8080 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) |
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8080-1G2CONN SOCKET TRANSIST TO-3 3POS |
3,166 | 0.00 |
RFQ |
![]() Datasheet |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) |
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8080-1G3CONN SOCKET TRANSIST TO-3 3POS |
3,777 | 0.00 |
RFQ |
![]() Datasheet |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic |
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8080-1G35CONN SOCKET TRANSIST TO-3 3POS |
3,387 | 0.00 |
RFQ |
![]() Datasheet |
Bulk | - | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Diallyl Phthalate (DAP) |
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510-AG92D-10CONN SOCKET SIP 10POS TIN-LEAD |
2,195 | 0.00 |
RFQ |
Bulk | - | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | - | Beryllium Copper | Thermoplastic | |
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2-382712-1CONN IC DIP SOCKET 16POS TIN |
3,453 | 0.00 |
RFQ |
![]() Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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2-382714-1CONN IC DIP SOCKET 20POS TIN |
2,681 | 0.00 |
RFQ |
![]() Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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2-382719-1CONN IC DIP SOCKET 30POS TIN |
3,046 | 2.26 |
RFQ |
![]() Datasheet |
Tube,Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
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1939416-1CONN SOCKET LGA 1207POS GOLD |
3,187 | 0.00 |
RFQ |
![]() Datasheet |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
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1939416-2CONN SOCKET LGA 1207POS GOLD |
2,799 | 0.00 |
RFQ |
![]() Datasheet |
Tray | - | Active | LGA | 1207 (33 x 34) | 0.043 (1.09mm) | Gold | - | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.043 (1.09mm) | - | - | - | Thermoplastic |
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524-AG11DCONN IC DIP SOCKET 24POS GOLD |
2,433 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Polyester |
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814-AG11DCONN IC DIP SOCKET 14POS GOLD |
3,769 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
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814-AG11D-ESCONN IC DIP SOCKET 14POS GOLD |
3,545 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
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818-AG11D-ESLCONN IC DIP SOCKET 18POS GOLD |
2,420 | 0.00 |
RFQ |
![]() Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
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2174988-1CONN SOCKET LGA 2011POS GOLD |
2,061 | 0.00 |
RFQ |
![]() Datasheet |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.035 (0.90mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |