Chip Start Electronics Co., Limited

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RFI and EMI - Contacts, Fingerstock and Gaskets(4831)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	Shape	Width	Length	Height	Material	Plating	Plating-Thickness	AttachmentMethod
4268AB51K00300 GK NICU NRS PU V0 REC Laird Technologies EMI	2,160	1.41	RFQ	Datasheet	Bulk	51K	Active	Fabric Over Foam	Rectangle	0.161 (4.10mm)	3.000 (76.20mm)	0.071 (1.80mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-
4358AB51K00200 GK NICU NRS PU V0 DSH Laird Technologies EMI	3,610	1.43	RFQ	Datasheet	Bulk	51K	Active	Fabric Over Foam	D-Shape	0.098 (2.50mm)	2.000 (50.80mm)	0.059 (1.50mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-
0097096517 RC,SNB,CLO .025X1.785X.430 Laird Technologies EMI	3,569	1.44	RFQ		Bulk	-	Active	Fingerstock	-	0.510 (12.95mm)	15.000 (381.00mm)	0.140 (3.56mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Clip
0097048917 BATCON,SNB .310X.740X.150 Laird Technologies EMI	3,017	1.44	RFQ		Bulk	-	Active	Fingerstock	-	-	-	-	-	Tin	299.21µin (7.60µm)	-
0077004017 SLMT,2F,SNB .110X.280X.187X.356I Laird Technologies EMI	2,377	1.44	RFQ		Bulk	77	Active	Fingerstock	-	0.787 (20.00mm)	0.356 (9.04mm)	0.110 (2.79mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
0097097319 CGCLIP,NIB,CLO .049X.080X.375 Laird Technologies EMI	2,836	1.44	RFQ		Bulk	-	Active	Fingerstock	-	-	-	-	-	Nickel	299.21µin (7.60µm)	-
0097096417 RC,PCS,SNB,CLO .025X1.723X.320IN Laird Technologies EMI	3,047	1.44	RFQ		Bulk	-	Active	Fingerstock	-	0.380 (9.65mm)	15.000 (381.00mm)	0.110 (2.79mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
67BSG2004507012R0B SP,CON,S,AU,TNR Laird Technologies EMI	2,727	1.47	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-
11-S-32AF-SN-0.917 0.11 X 0.32 SN 0.917--11-S-32AF- Leader Tech Inc.	2,494	1.47	RFQ	Datasheet	Bulk	-	Active	Fingerstock	-	0.320 (8.13mm)	0.917 (23.29mm)	0.110 (2.79mm)	Beryllium Copper	Tin	Flash	Adhesive
67BSG2506508015R00 SP,CON,S,AU,TNR Laird Technologies EMI	2,290	1.49	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-
8-19PCI-SS-3.80 0.067 X 0.19 SS 3.80--8-19PCI-SS Leader Tech Inc.	3,966	1.51	RFQ	Datasheet	Bulk	-	Active	Fingerstock	-	0.190 (4.83mm)	3.800 (96.52mm)	0.070 (1.78mm)	Beryllium Copper	-	-	Adhesive
67B3G2504810010R00 SP,CON,AU,TNR 10X2.5X4.8MM Laird Technologies EMI	2,963	1.53	RFQ		Bulk	B3G	Active	Fingerstock	-	0.098 (2.50mm)	0.189 (4.80mm)	0.394 (10.00mm)	Beryllium Copper	Gold	-	Solder
0097097317 CGCLIP,SNB,CLO Laird Technologies EMI	2,916	1.53	RFQ	Datasheet	Bulk	Card Guide Clip-On	Active	-	-	0.120 (3.05mm)	0.360 (9.14mm)	-	-	-	-	-
0097078702 HZCONGK,BF Laird Technologies EMI	3,689	1.64	RFQ	Datasheet	Bulk	IEEE 1394	Active	Fingerstock	-	-	-	-	Beryllium Copper	-	-	Slot
67BSG2507012015R0B SP,CON,S,AU,TNR Laird Technologies EMI	3,699	1.70	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-
8863-0110-72 EMI Laird Technologies EMI	3,428	1.76	RFQ		Bag	Electroseal™ EcE72	Active	Gasket	Round	0.067 (1.70mm)	-	-	-	-	-	-
4084PA51H00217 GK NICU PTAFG PU V0 SQ Laird Technologies EMI	3,751	1.77	RFQ	Datasheet	Bulk	51H	Active	Fabric Over Foam	Square	0.500 (12.70mm)	2.170 (55.12mm)	0.500 (12.70mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive
19-04-22371-S6305 CHO-SEAL S6305 NI/C 0.043 1' Parker Chomerics	2,044	1.78	RFQ	Datasheet	Spool	-	Active	Gasket	Round	0.043 (1.09mm)	12.000 (304.80mm)	-	Conductive Elastomer	Nickel	-	Non-Conductive Adhesive
4202PA51G00400 GK,NICU,NRSG,PU,V0,DSH .120X.250 Laird Technologies EMI	3,935	1.84	RFQ		Bulk	51G	Active	Fabric Over Foam	D-Shape	0.250 (6.35mm)	4.000 (101.60mm)	0.120 (3.05mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	Adhesive
SG090150D-24 .090H X .150W X 24L--D SHAPED Leader Tech Inc.	3,543	1.85	RFQ	Datasheet	Bulk	-	Active	Fabric Over Foam	D-Shape	0.150 (3.81mm)	24.000 (609.60mm)	0.090 (2.29mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-