Chip Start Electronics Co., Limited

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RFI and EMI - Contacts, Fingerstock and Gaskets(4831)

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	Shape	Width	Length	Height	Material	Plating	Plating-Thickness	AttachmentMethod
4246AB51K01200 GK NICU NRS PU V0 REC Laird Technologies EMI	3,753	2.82	RFQ	Datasheet	Bulk	51K	Active	Fabric Over Foam	Rectangle	0.091 (2.30mm)	12.000 (304.80mm)	0.051 (1.30mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-
4042AB51K01200 GK NICU NRS PU V0 REC Laird Technologies EMI	3,147	2.82	RFQ	Datasheet	Bulk	51K	Active	Fabric Over Foam	Rectangle	0.126 (3.20mm)	12.000 (304.80mm)	0.118 (3.00mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-
4078PA51H00300 GK NICU PTAFG PU V0 DSH Laird Technologies EMI	2,475	2.82	RFQ	Datasheet	Bulk	51H	Active	Fabric Over Foam	D-Shape	0.358 (9.10mm)	3.000 (76.20mm)	0.118 (3.00mm)	Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)	-	-	Adhesive
0097077902 DCON,BF 0.6X17.5X44.2MM Laird Technologies EMI	2,936	2.84	RFQ		Bulk	-	Active	Fingerstock	-	0.690 (17.53mm)	1.740 (44.20mm)	0.025 (0.64mm)	Beryllium Copper	Unplated	-	Slot
0097077817 DCON,9P,SNB Laird Technologies EMI	3,251	2.92	RFQ	Datasheet	Bulk	D Connector	Active	Fingerstock	-	0.690 (17.53mm)	1.410 (35.81mm)	0.025 (0.64mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
7-19PCI-SS-9.2 0.067 X 0.177 SS 9.2--7-19PCI-SS Leader Tech Inc.	3,451	2.94	RFQ	Datasheet	Bulk	-	Active	Fingerstock	-	0.180 (4.57mm)	9.200 (233.68mm)	0.070 (1.78mm)	Beryllium Copper	-	-	Adhesive
19-04-27855-S6305 CHO-SEAL S6305 NI/C 0.048 1' Parker Chomerics	3,499	2.96	RFQ	Datasheet	Spool	-	Active	Gasket	Round	0.048 (1.22mm)	12.000 (304.80mm)	-	Conductive Elastomer	Nickel	-	Non-Conductive Adhesive
8564-0167-12 OSTRHOLCTL,ECE012 10.3X5.7X7MM Laird Technologies EMI	3,144	2.96	RFQ		Bulk	-	Active	-	-	-	-	-	-	-	-	-
0097077917 DCON,15P,SNB Laird Technologies EMI	3,223	2.99	RFQ	Datasheet	Bulk	D Connector	Active	Fingerstock	-	0.690 (17.53mm)	1.740 (44.20mm)	0.025 (0.64mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
0097082517 DCON,150,SNB Laird Technologies EMI	2,684	2.99	RFQ	Datasheet	Bulk	D Connector-Slotted	Active	Fingerstock	-	0.690 (17.53mm)	1.740 (44.20mm)	0.025 (0.64mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
8863-0100-89 OSTRSD,ECE089 1.0MM Laird Technologies EMI	3,751	3.00	RFQ		Bulk	Electroseal™ EcE89	Active	-	-	-	-	-	-	-	-	-
19-04-25875-S6305 CHO-SEAL S6305 NI/C 0.050 1' Parker Chomerics	2,702	3.01	RFQ	Datasheet	Spool	-	Active	Gasket	Round	0.050 (1.27mm)	12.000 (304.80mm)	-	Conductive Elastomer	Nickel	-	Non-Conductive Adhesive
CF710EA02541049 GK, NICU,CF,V0 1X25.4X104.9MM Laird Technologies EMI	2,810	3.01	RFQ	Datasheet	Bulk	-	Active	-	-	-	-	-	-	-	-	-
4056AB51K01200 GK NICU NRS PU V0 REC Laird Technologies EMI	2,258	3.04	RFQ	Datasheet	Bulk	51K	Active	Fabric Over Foam	Rectangle	0.201 (5.10mm)	12.000 (304.80mm)	0.059 (1.50mm)	Polyurethane Foam, Nickel-Copper Polyester (NI/CU)	-	-	-
4688AA51G01800 GK NICU NRSG PU V0 REC Laird Technologies EMI	3,182	3.05	RFQ	Datasheet	Bulk	51G	Active	Fabric Over Foam	Rectangle	0.118 (3.00mm)	18.000 (457.20mm)	0.079 (2.00mm)	-	-	-	-
8560-0144-81 DIECUT,ECE081 Laird Technologies EMI	3,135	3.10	RFQ		Bulk	8560	Active	Gasket	Round	0.657 (16.70mm)	-	0.063 (1.60mm)	-	-	-	-
4520PA22101800 GASKET FAB/FOAM 2.03X457.2MM SQ Laird Technologies EMI	2,132	3.13	RFQ	Datasheet	Bulk	221 FOF	Active	Fabric Over Foam	Square	2.000 (50.80mm)	18.000 (457.20mm)	2.000 (50.80mm)	-	-	-	Adhesive
0097078117 DCON,37P,SNB Laird Technologies EMI	3,254	3.15	RFQ	Datasheet	Bulk	D Connector	Active	Fingerstock	-	0.690 (17.53mm)	2.930 (74.42mm)	0.025 (0.64mm)	Beryllium Copper	Tin	299.21µin (7.60µm)	Slot
4184PA22101800 GSKT FAB/FOAM 3.8X457.2MM DSHAPE Laird Technologies EMI	3,873	3.19	RFQ	Datasheet	Bulk	221 FOF	Active	Fabric Over Foam	D-Shape	0.150 (3.80mm)	18.000 (457.20mm)	0.059 (1.50mm)	-	-	-	Adhesive
0097073217 GB,4F,SNB Laird Technologies EMI	3,606	3.29	RFQ		Bulk	Foldover	Active	Fingerstock	-	-	-	-	Beryllium Copper	-	-	Slot